Wire Bonding Machine Video

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Wire bonding machine video. All wire bonding equipment test finish handling system deposition process equipment dispensing equipment surface mount technology wafer separation encapsulation equipment sintering equipment aoi fol equipment singulation trim form system cis equipment die attach equipment led testing sorting taping system factory automation. Prolyx microelectronics private limited wire bonding machine semiconductor wafers wafer handling accessories manufacturer from bengaluru karnataka india. The wire bonding machine that attaches a very thin gold wire from anode to the silicon die sitting on the cathode. Aluminum wire bonding is a process similar to gold wire bonding but with the key distinction that the surface does not need to be heated to 150c or even anything above room temperature.

Wire bonding is the method of making interconnections between an integrated circuit ic or other semiconductor device and its packaging during semiconductor device fabrication although less common wire bonding can be used to connect an ic to other electronics or to connect from one printed circuit board pcb to another. Wire bonding is generally considered the most cost effective and. K s launches ultralux automatic wire bonder ultralux is the latest generation ball bonder utilizing the latest technologies and materials that will save led manufacturers up to 10 capital cost.